The ultra-high-speed 3D SPI KY8030-3 for dealing with high-speed batch production lines adopts the patented 3D inspection technology of Gaoying, eliminating all measurement uncertainties caused by shadow problems and meeting the requirements of ultra-high-speed production lines. Introduce the KY8030-3 product that can meet various customer needs.
| Camera resolution |
FOV size |
Maximum detection height |
| 4M 10um |
20mmx20mm |
400um 15.75mils |
| 4M 15um |
30mmx30mm |
400um 15.75mils |
| 4M 20um |
40mmx40mm |
400um 15.75mils |
The best measurement accuracy and detection reliability in the industry
KY8030-3 is a product that combines a detection speed of 91.2cm ² /sec with advanced high-tech. KY8030-3 combines the processing capacity and accuracy of this system and has a wide range of applications. The latest option ensures the measurement accuracy of this system, which is twice as fast as the previous system.
Real-time plate bending compensation solution
Are the measurement results often affected by PCB bending? Gao Ying's Z-tracking 3D bending compensation solution can extract PCB bending information during detection and conduct stable measurement and detection of the bending of any substrate.
Based on Gao Ying's unique 3D imaging processing and vision algorithm, precise measurement and detection can be achieved even in various environments such as tilting, expanding, twisting, bending, and contracting.
Furthermore, the real-time automatic Pad-referencing 2D compensation option, through high-specification IR lighting, can analyze the position of the PCB Pad without the ideal PCB Stencil design information defined in the CAD file, thereby automatically compensating for
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